{
  "schema_version": "1.4.0",
  "id": "GHSA-xrhc-ww54-4jw7",
  "modified": "2022-02-19T00:02:07Z",
  "published": "2022-02-12T00:00:51Z",
  "aliases": [
    "CVE-2021-30324"
  ],
  "details": "Possible out of bound write due to lack of boundary check for the maximum size of buffer when sending a DCI packet to remote process in Snapdragon Auto, Snapdragon Compute, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables, Snapdragon Wired Infrastructure and Networking",
  "severity": [],
  "affected": [],
  "references": [
    {
      "type": "ADVISORY",
      "url": "https://nvd.nist.gov/vuln/detail/CVE-2021-30324"
    },
    {
      "type": "WEB",
      "url": "https://www.qualcomm.com/company/product-security/bulletins/february-2022-bulletin"
    }
  ],
  "database_specific": {
    "cwe_ids": [
      "CWE-120"
    ],
    "severity": "MODERATE",
    "github_reviewed": false,
    "github_reviewed_at": null,
    "nvd_published_at": "2022-02-11T11:15:00Z"
  }
}