{
  "schema_version": "1.4.0",
  "id": "GHSA-5c77-mfvp-hp63",
  "modified": "2022-05-24T17:32:49Z",
  "published": "2022-05-24T17:32:49Z",
  "aliases": [
    "CVE-2020-11155"
  ],
  "details": "u'Buffer overflow while processing PDU packet in bluetooth due to lack of check of buffer length before copying into it.' in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer Electronics Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wired Infrastructure and Networking in APQ8009, APQ8053, QCA6390, QCN7605, QCN7606, SA415M, SA515M, SA6155P, SA8155P, SC8180X, SDX55",
  "severity": [],
  "affected": [],
  "references": [
    {
      "type": "ADVISORY",
      "url": "https://nvd.nist.gov/vuln/detail/CVE-2020-11155"
    },
    {
      "type": "WEB",
      "url": "https://www.qualcomm.com/company/product-security/bulletins/october-2020-bulletin"
    },
    {
      "type": "WEB",
      "url": "https://www.qualcomm.com/company/product-security/bulletins/october-2020-security-bulletin"
    }
  ],
  "database_specific": {
    "cwe_ids": [
      "CWE-120"
    ],
    "severity": "HIGH",
    "github_reviewed": false,
    "github_reviewed_at": null,
    "nvd_published_at": "2020-11-02T07:15:00Z"
  }
}