{
  "schema_version": "1.4.0",
  "id": "GHSA-6cxh-hvrc-px7m",
  "modified": "2022-05-13T01:24:20Z",
  "published": "2022-05-13T01:24:20Z",
  "aliases": [
    "CVE-2016-2063"
  ],
  "details": "Stack-based buffer overflow in the supply_lm_input_write function in drivers/thermal/supply_lm_core.c in the MSM Thermal driver for the Linux kernel 3.x, as used in Qualcomm Innovation Center (QuIC) Android contributions for MSM devices and other products, allows attackers to cause a denial of service or possibly have unspecified other impact via a crafted application that sends a large amount of data through the debugfs interface.",
  "severity": [
    {
      "type": "CVSS_V3",
      "score": "CVSS:3.1/AV:L/AC:L/PR:L/UI:N/S:U/C:H/I:H/A:H"
    }
  ],
  "affected": [],
  "references": [
    {
      "type": "ADVISORY",
      "url": "https://nvd.nist.gov/vuln/detail/CVE-2016-2063"
    },
    {
      "type": "WEB",
      "url": "https://us.codeaurora.org/cgit/quic/la/kernel/msm-3.10/commit/?id=ab3f46119ca10de87a11fe966b0723c48f27acd4"
    },
    {
      "type": "WEB",
      "url": "https://www.codeaurora.org/stack-overflow-msm-thermal-driver-allows-kernel-memory-corruption-cve-2016-2063"
    },
    {
      "type": "WEB",
      "url": "http://www.securityfocus.com/bid/92381"
    }
  ],
  "database_specific": {
    "cwe_ids": [
      "CWE-119"
    ],
    "severity": "HIGH",
    "github_reviewed": false,
    "github_reviewed_at": null,
    "nvd_published_at": "2016-08-07T21:59:00Z"
  }
}