{
  "schema_version": "1.4.0",
  "id": "GHSA-g788-2pq2-2cqh",
  "modified": "2022-05-24T17:01:44Z",
  "published": "2022-05-24T17:01:44Z",
  "aliases": [
    "CVE-2019-2266"
  ],
  "details": "Possible double free issue in kernel while handling the camera sensor and its sub modules power sequence in Snapdragon Auto, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon IoT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables, Snapdragon Wired Infrastructure and Networking in APQ8053, IPQ4019, IPQ8064, MDM9206, MDM9207C, MDM9607, MSM8909, MSM8909W, Nicobar, QCA9980, QCS405, QCS605, SDM845, SDX24, SM7150, SM8150",
  "severity": [],
  "affected": [],
  "references": [
    {
      "type": "ADVISORY",
      "url": "https://nvd.nist.gov/vuln/detail/CVE-2019-2266"
    },
    {
      "type": "WEB",
      "url": "https://www.qualcomm.com/company/product-security/bulletins/october-2019-bulletin"
    }
  ],
  "database_specific": {
    "cwe_ids": [],
    "severity": "MODERATE",
    "github_reviewed": false,
    "github_reviewed_at": null,
    "nvd_published_at": "2019-11-21T15:15:00Z"
  }
}