{
  "schema_version": "1.4.0",
  "id": "GHSA-f8g3-423w-47gv",
  "modified": "2022-05-24T17:08:13Z",
  "published": "2022-05-24T17:08:13Z",
  "aliases": [
    "CVE-2019-14051"
  ],
  "details": "Subsequent additions performed during Module loading while allocating the memory would lead to integer overflow and then to buffer overflow in Snapdragon Industrial IOT in MDM9206, MDM9607",
  "severity": [],
  "affected": [],
  "references": [
    {
      "type": "ADVISORY",
      "url": "https://nvd.nist.gov/vuln/detail/CVE-2019-14051"
    },
    {
      "type": "WEB",
      "url": "https://www.qualcomm.com/company/product-security/bulletins/february-2020-bulletin"
    }
  ],
  "database_specific": {
    "cwe_ids": [],
    "severity": "HIGH",
    "github_reviewed": false,
    "github_reviewed_at": null,
    "nvd_published_at": "2020-02-07T05:15:00Z"
  }
}