{
  "schema_version": "1.4.0",
  "id": "GHSA-fcrq-wmf7-mhqw",
  "modified": "2022-05-24T17:24:41Z",
  "published": "2022-05-24T17:24:41Z",
  "aliases": [
    "CVE-2019-14037"
  ],
  "details": "Close and bind operations done on a socket can lead to a Use-After-Free condition. in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer Electronics Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon IoT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables in APQ8009, APQ8053, APQ8096AU, APQ8098, MDM9206, MDM9207C, MDM9607, MDM9640, MDM9650, MSM8905, MSM8909W, MSM8996, MSM8996AU, QCN7605, QCN7606, QCS605, SC8180X, SDA660, SDA845, SDM439, SDM630, SDM636, SDM660, SDM670, SDM710, SDM845, SDX20, SDX24, SDX55, SM8150, SXR1130",
  "severity": [],
  "affected": [],
  "references": [
    {
      "type": "ADVISORY",
      "url": "https://nvd.nist.gov/vuln/detail/CVE-2019-14037"
    },
    {
      "type": "WEB",
      "url": "https://www.qualcomm.com/company/product-security/bulletins/july-2020-bulletin"
    },
    {
      "type": "WEB",
      "url": "https://www.qualcomm.com/company/product-security/bulletins/july-2020-security-bulletin"
    }
  ],
  "database_specific": {
    "cwe_ids": [],
    "severity": "MODERATE",
    "github_reviewed": false,
    "github_reviewed_at": null,
    "nvd_published_at": "2020-07-30T12:15:00Z"
  }
}