{
  "schema_version": "1.4.0",
  "id": "GHSA-rfrq-rwq7-7pf3",
  "modified": "2022-05-14T03:00:09Z",
  "published": "2022-05-14T03:00:09Z",
  "aliases": [
    "CVE-2018-5878"
  ],
  "details": "While sending the response to a RIL_REQUEST_GET_SMSC_ADDRESS message, a buffer overflow can occur in Snapdragon Automobile, Snapdragon Mobile and Snapdragon Wear.",
  "severity": [
    {
      "type": "CVSS_V3",
      "score": "CVSS:3.0/AV:N/AC:L/PR:N/UI:N/S:U/C:H/I:H/A:H"
    }
  ],
  "affected": [],
  "references": [
    {
      "type": "ADVISORY",
      "url": "https://nvd.nist.gov/vuln/detail/CVE-2018-5878"
    },
    {
      "type": "WEB",
      "url": "https://www.qualcomm.com/company/product-security/bulletins"
    }
  ],
  "database_specific": {
    "cwe_ids": [
      "CWE-119"
    ],
    "severity": "CRITICAL",
    "github_reviewed": false,
    "github_reviewed_at": null,
    "nvd_published_at": "2018-07-06T17:29:00Z"
  }
}