{
  "schema_version": "1.4.0",
  "id": "GHSA-rhv8-c8mx-v4h4",
  "modified": "2022-05-13T01:44:40Z",
  "published": "2022-05-13T01:44:40Z",
  "aliases": [
    "CVE-2017-18313"
  ],
  "details": "Under certain mode of operations, HLOS may be able get direct or indirect access through DXE channels to tamper with the authenticated WCNSS firmware stored in DDR because DXE-accessible memory is located within the authenticated image in Snapdragon Mobile and Snapdragon Wear in version MSM8909W, SD 210/SD 212/SD 205, SD 410/12, SD 615/16/SD 415, SD 617.",
  "severity": [
    {
      "type": "CVSS_V3",
      "score": "CVSS:3.0/AV:A/AC:H/PR:N/UI:N/S:U/C:N/I:H/A:N"
    }
  ],
  "affected": [],
  "references": [
    {
      "type": "ADVISORY",
      "url": "https://nvd.nist.gov/vuln/detail/CVE-2017-18313"
    },
    {
      "type": "WEB",
      "url": "https://source.android.com/security/bulletin/2018-09-01#qualcomm-closed-source-components"
    },
    {
      "type": "WEB",
      "url": "https://www.qualcomm.com/company/product-security/bulletins"
    }
  ],
  "database_specific": {
    "cwe_ids": [],
    "severity": "MODERATE",
    "github_reviewed": false,
    "github_reviewed_at": null,
    "nvd_published_at": "2018-10-23T13:29:00Z"
  }
}