{
  "schema_version": "1.4.0",
  "id": "GHSA-w3vp-q725-9fj8",
  "modified": "2022-05-24T17:08:19Z",
  "published": "2022-05-24T17:08:19Z",
  "aliases": [
    "CVE-2019-17517"
  ],
  "details": "The Bluetooth Low Energy implementation on Dialog Semiconductor SDK through 5.0.4 for DA14580/1/2/3 devices does not properly restrict the L2CAP payload length, allowing attackers in radio range to cause a buffer overflow via a crafted Link Layer packet.",
  "severity": [],
  "affected": [],
  "references": [
    {
      "type": "ADVISORY",
      "url": "https://nvd.nist.gov/vuln/detail/CVE-2019-17517"
    },
    {
      "type": "WEB",
      "url": "https://asset-group.github.io/disclosures/sweyntooth"
    },
    {
      "type": "WEB",
      "url": "https://www.dialog-semiconductor.com/products/connectivity/bluetooth-low-energy/smartbond-da14580-and-da14583"
    }
  ],
  "database_specific": {
    "cwe_ids": [
      "CWE-120"
    ],
    "severity": "MODERATE",
    "github_reviewed": false,
    "github_reviewed_at": null,
    "nvd_published_at": "2020-02-10T21:51:00Z"
  }
}